Signal Integrity Engineer

Signal Integrity Engineer

Overview

Join a growing hardware engineering team advancing high-speed electronic systems. As a Signal Integrity Engineer, you will lead end-to-end signal integrity analysis across PCBs, chip packages, substrates, components, and interconnects. Your work will help optimize channel performance from early pre-silicon modeling through design iteration and, when needed, post-silicon validation.

You will collaborate with a multidisciplinary hardware engineering team to build 3D electromagnetic models, evaluate complex high-speed interfaces, identify signal performance bottlenecks, and guide design decisions that support reliable, production-ready systems. Approximately 70% of the role will focus on pre-silicon 3D electromagnetic modeling and channel data extraction, with the remaining time dedicated to signal integrity analysis, design iteration, and cross-functional collaboration.

Required Skills

• 5–10+ years of dedicated experience in signal integrity and packaging analysis.
• Expert proficiency with industry-standard simulation tools, including:
• Ansys HFSS
• Ansys SIwave
• Keysight ADS
• Proven experience analyzing high-speed interfaces such as:
• PCIe
• UCIe
• SerDes
• Experience conducting full-system signal integrity analysis across components, substrates, chip packages, and PCB designs.
• Ability to build and extract 3D electromagnetic models for packages, boards, substrates, and interconnect paths.
• Strong knowledge of:
• Eye diagrams
• Jitter
• Insertion loss
• Return loss
• Crosstalk
• S-parameter analysis
• Solid understanding of PCB stack-up architecture, material properties, routing rules, and high-speed design fundamentals.
• Ability to interpret simulation results, identify signal performance issues, and recommend design improvements.
• Strong collaboration skills and the ability to work effectively with multidisciplinary hardware engineering teams.

Nice-to-Have Skills

• Experience automating simulation workflows and post-processing using Python, JavaScript, or Ocean/SKILL scripting.
• Hands-on experience with laboratory characterization equipment, including:
• Vector network analyzers (VNAs)
• Time-domain reflectometers (TDRs)
• High-speed oscilloscopes
• Experience with model-to-measurement correlation.
• Exposure to post-silicon lab bring-up and measurement validation.
• Experience with DDR memory channels and related high-speed design analysis.

Preferred Education and Experience

• Bachelor’s or master’s degree in Electrical Engineering, Electronics, or a related field.
• 5–10+ years of relevant industry experience in signal integrity, packaging analysis, high-speed design, or a related discipline.

Other Requirements

• Available as a remote or hybrid opportunity.
• Hybrid work locations are available in Boston, MA, or San Jose, CA.
• Employment may be available on a contract or full-time basis.
• Ability to support pre-silicon 3D electromagnetic modeling, channel data extraction, signal integrity analysis, and design iteration.
• Post-silicon lab bring-up, measurement validation, and correlation may be required as needed.